Bonding in microsystem technology starts with descriptions of terminology kinds of microsystems and market analysis followed by the presentation of mechanisms of wet etching set of process parameters description of micromachining methods examples of procedures process flow charts and applications of basic micromechanical structures in microsystems are shown. Bonding in microsystem technology authors jan a dziuban series title springer series in advanced microelectronics series volume 24 copyright 2006 publisher springer netherlands copyright holder springer science business media bv ebook isbn 978 1 4020 4589 9 doi 101007 1 4020 4589 1 hardcover isbn 978 1 4020 4578 3 softcover isbn 978 90 481 7151 4 series issn. The springer series in advanced microelectronics provides systematic information on all the topics relevant for the design processing and manufacturing of microelectronic devices the books each prepared by leading researchers or engineers in their f ields cover the basic and advanced aspects of topics such as wafer processing materials . Bonding in microsystem technology springer series in advanced microelectronics 24 2006th edition by jan a dziuban author isbn 13 978 1402045783